FABRICATION OF A THREE-COMPONENT FORCE SENSOR USING MICROFABRICATION TECHNOLOGY AND ITS EVALUATION

Jong-Ho Kim, Hyo-Jik Lee, Jeong-Il Lee, Yon-Kyu Park, Min-Seok Kim, Dae-Im Kang

Abstract

This paper describes the development of a three-component silicon-based force sensor with a square membrane using bulk micromachining process. The designed sensor, with size of 2 mm x 2 mm, has a maximum force range of 5 N in the x, y, and z direction. Optimal locations of piezoresistors were determined by the strain distribution obtained from finite element analysis and beam theory. Finally three Wheatstone bridge circuits were arranged and verified under Fx, Fy, and Fz loading conditions. The silicon-based sensor was fabricated using bulk microfabrication technology(MEMS). The piezoresistors for measuring the change of resistance, like strain gage, were embedded in silicon wafer (Si) using ion- implantation diffusion technique. An epoxy mesa(SU-8) is built-up on top of the silicon to convert an applied force to a distributed stress. Finally, the membrane of the sensor was fabricated by using bulk- micromachining process based on the anisotropic etching of the silicon. The ability of the sensor to measure both normal and shear forces is investigated and demonstrated through experimental characterization such as normal and shear sensitivity, repeatability, hysteresis and linearity.

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DOI

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IMEKO TC

TC3 - Measurement of Force, Mass, Torque, and Gravity

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