EXPERIMENTAL ANALYSIS OF THERMO-MECHANICAL MATERIAL PROPERTIES OF PHOTOSENSITIVE POLYMERS

J. Vogel, H.-J. Feige, J. Saupe, S. Schubert, J. Grimm

Abstract

Micro tensile test and Dynamic Mechanical Analysis (DMA) are used to evaluate the material behaviour and several process steps of photosensitive polymers. DMA allows the determination of storage modulus, loss tangent or glass transition region as function of time, temperature and frequency. Furthermore, a sensitive loading device has been developed to carry out tensile tests at polymer micro samples. Stress-strain-curves, YOUNG’s modulus or POISSON’s ratio are analysed by Digital Image Correlation. The results are suitable to modify the process parameters, to characterise thermal and mechanical properties and to develop new application fields.

Keywords

polymer MEMS, photoresist technology, dynamic mechanical analysis, uniaxial tensile test, digital image correlation, material parameter

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IMEKO-YSESM-2012-K09.pdf

DOI

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IMEKO TC

TC15 - Experimental Mechanics

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