MECHANICAL CHARACTERIZATION OF GLASS FRIT BONDED WAFERS

K. Vogel, D. Wuensch, S. Uhlig, J. Froemel, F. Naumann, M. Wiemer, T. Gessner

Abstract

Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical systems on industrial scale. Especially glass frit bonding is often used for the encapsulation of MEMS devices on wafer level. To ensure the reliability of these bonds and to prevent critical failure of the systems, characteristic mechanical properties of the bonded interface are required. The fracture toughness and the shear strength are suitable values to characterize the bonding strength and can be determined by micro chevron and shear testing. They depend on the bonding parameters as well as the test speed. Due to the correlation between measured bonding strength and test speed a maximum test speed has to be identified to obtain reliable failure criteria regarding the fracture toughness and the shear strength.

Keywords

glass frit bonding, stress intensity coefficient, fracture toughness, shear strength, influence of test speed

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IMEKO-YSESM-2012-39.pdf

DOI

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IMEKO TC

TC15 - Experimental Mechanics

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