THE EFFECT OF DWELL TIME VARIATION DURING MICROHARDNESS TESTING
Abstract
Operation of microelectronic components at higher temperatures and for long periods is one of the major reasons for technical failure of solder joints due to creep effect. This effect also has an influence on the determination of local mechanical material properties via nanoindentation tests. It generally occurs during the dwell time of the indentation procedure. In order to analyze its influence on the measured values of Young’s modulus several nanoindentation tests were performed at different elevated temperatures for a eutectic lead-free solder material, namely Sn24Bi58, which has its melting point at 138°C. In these tests the dwell times were varied between 30 and 240 seconds.
Event details
- Event
- TC15 Youth Symposium 2011
- Technical Committee
- TC15
- Place
- Chemnitz, GERMANY
- Time
- 25 May 2011 - 28 May 2011