DEVELOPMENT OF THERMAL DIFFUSIVITY STANDARD FOR THIN FILMS: REFERENCE THIN FILM AND MEASUREMENT METHOD

Takashi Yagi

Abstract

The reference thin metal film to calibrate for the thermal diffusivity is being developed in NMIJ. Mo thin film with a nominal thickness of 400 nm is candidate for the reference film. To inspect the fabrication process of the reference material, test films were prepared and estimated in terms of scatter of the physical properties. Thermal diffusivity of those films were measured using the pulsed light heating thermoreflectance apparatus originally developed by NMIJ. The measured thermal diffusivity is 3.46 × 10^-5 m² s^-1 and the standard deviation is 0.05 × 10^-5 m² s^-1 (1.6%) for 8 films sampled from a total of 75 films. We plan to supply the reference thin films based on above mentioned technology in 2014FY.

Keywords

thermal diffusivity, Mo, reference film

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DOI

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IMEKO TC

TC14 - Measurement of Geometrical Quantities

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