CT based analysis of reworked BGA devices

Imre Fekete, István Kozma, Róbert Csontos

Abstract

The widespread use of computed tomography in the electronic field allows for an extended range of measurements to be carried out. High integration devices can be tested easily with µCT, and provide large amount of data to characterize the technology parameters. This paper focuses on the inspection of BGA solder ball geometry and quantification of different properties of the solder arrays.

Keywords

BGA soldering, µCT

Download

IMEKO-TC4-2016-55.pdf

DOI

-

IMEKO TC

TC4 - Measurement of Electrical Quantities

Back to the proceedings