Evaluation of surface quality of ground Al/SiCp metal matrix composites

B. Anand Ronald, L. Vijayaraghavan, R. Krishnamurthy

Abstract

A detailed study on grinding of metal matrix composites with resin bonded and plated diamond wheels have been carried out to evaluate the surface quality. The measurands namely grinding force and temperature during grinding were monitored online. Surface finish was measured offline using a stylus based instrument and the ground surface was observed through Scanning Electron Microscope (SEM) for process status evaluation. From the study, it was found that better surface quality (based on surface finish and SEM of machined surface) was achievable with resin bonded wheel as compared to electroplated wheel. Also electroplated wheel experiences higher order force.

Keywords

Grinding; Resin bond; Electroplated bond; Surface finish

Download

IMEKO-TC14-2007-19.pdf

DOI

-

IMEKO TC

TC14 - Measurement of Geometrical Quantities

Back to the proceedings