Influence of gap voltage and tool material on micro geometry produced on silicon wafer using micro-EDM

Muralidhara, S. Majumder, N. J. Vasa, M. Singaperumal

Abstract

In the present work, a Micro EDM (Micro Electro Discharge Machine) is developed in-house with piezoactuated adaptive tool feed mechanism and investigations on Silicon wafer machining is carried out at different machining conditions and with copper and tungsten tool materials. Kerosene is used as the dielectric medium. The influence of the tool feed mechanism on the surface roughness is investigated with different feed back gap voltages and it was found that gap feed back voltage of 23V generates better surfaces when compared to lower feed back gap voltages. The effect of sparking frequency on surface roughness is investigated and it was found that higher frequencies generate a good surface with lower surface roughness value. Side Spark Gap (SSG) is evaluated for copper and tungsten tool materials at different gap voltages and duty cycles. It was found that SSG increases with applied gap voltage. There was no much variation in SSG at different duty cycles. Copper tool material generates higher SSG compared to Tungsten tool.

Keywords

Micromachining; micro EDM; micro geometry; side spark gap

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DOI

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IMEKO TC

TC14 - Measurement of Geometrical Quantities

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