CT based analysis of reworked BGA devices |
|---|
| Imre Fekete, István Kozma, Róbert Csontos |
- Abstract:
- The widespread use of computed tomography in the electronic field allows for an extended range of measurements to be carried out. High integration devices can be tested easily with µCT, and provide large amount of data to characterize the technology parameters. This paper focuses on the inspection of BGA solder ball geometry and quantification of different properties of the solder arrays.
- Keywords:
- BGA soldering, µCT
- Download:
- IMEKO-TC4-2016-55.pdf
- DOI:
- -
- Event details
- IMEKO TC:
- TC4
- Event name:
- TC4 Symposium 2016
- Title:
21st IMEKO TC4 Symposium on Measurements of Electrical Quantities (together with 19th TC4 International Workshop on ADC and DCA Modeling and Testing, IWADC)
"Understanding the World through Electrical and Electronic Measurement"- Place:
- Budapest, HUNGARY
- Time:
- 07 September 2016 - 09 September 2016