Thin film thickness measurement for evaluation of residual layer of nano-imprint lithography using near-field optics |
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| S. Minamiguchi, S. Usuki, S. Takahashi, K. Takamasu |
- Abstract:
- Since a thin resin film with thickness of several 10nm remains as a residual film between the imprinted patterns and the substrate in the nano-imprint lithography process, it should be eliminated by reactive ion etching. To implement the etching process with high accuracy and to maintain the original patterns for realizing NIL as a highly reliable lithography process of semiconductor, it is seriously necessary to measure the thickness of the residual resin film before the etching process. In this article, we proposed a novel optical measurement method for the residual film thickness based on the near-field optics. As a result, the near-field optical responses are affected in relation to the film thickness and a distance between the resin surface and a fiber apex. We concluded that it is possible to measure the thin film thicknesses within 80nm with a few nm resolution by evaluating the near-field optical responses.
- Keywords:
- nano-imprint lithography; near-field optics; residual layer thickness; optical inspection
- Download:
- IMEKO-TC14-2007-30.pdf
- DOI:
- -
- Event details
- IMEKO TC:
- TC14
- Event name:
- TC14 ISMQC 2007
- Title:
9th Symposium on Measurement and Quality Control in Manufacturing
- Place:
- Chennai/Madras, INDIA
- Time:
- 21 November 2007 - 24 November 2007