ESPI TECHNQIUE FOR MEASURING MICRO-TENSILE PROPERTIES OF THIN FILM MATERIALS |
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| Yong-Hak Huh, Dong-Iel Kim,Chang-Doo Kee |
- Abstract:
- In-plane ESPI(electronic Speckle Pattern Interferometric) technique was developed to measure the micro-mechanical properties for thin film materials. The properties were determined from the micro-tensile stress and strain curve by measuring micro-tensile strain in micro-sized specimen 0.5 µm thick and 200 µm wide. The specimen was monotonically loaded by the micro-tensile loading system developed in this study. The micro-tensile strain during tensile loading was measured using the in-plane ESPI technique. In order to continuously measure the strain during loading, the subsequent strain measurement algorithm was developed. Furthermore, sensitivity to measurement of the strain was enhanced by phase estimation algorithms: sinusoidal fitting technique and object-induced dynamic phase shifting technique. Using these algorithms, the micro-tensile stress-strain curves were generated. It is shown that the sensitivity was increased by 6 times to a maximum.
- Keywords:
- ESPI technique, micro-tensile properties, thin film materials, subsequent strain measurement, sensitivity
- Download:
- PWC-2006-TC15-004u.pdf
- DOI:
- -
- Event details
- Event name:
- XVIII IMEKO World Congress
- Title:
Metrology for a Sustainable Development
- Place:
- Rio de Janeiro, BRAZIL
- Time:
- 17 September 2006 - 22 September 2006