The measurement of the radon in the environment became during the last years an important field of radiation protection. That is why, the necessity of calibration standards for the radon measuring devices became very important. This paper presents a way of radon track detector calibration wich was developed in the National Institute of R&D for Physics and Nuclear Engineering, Bucharest.

Assessment of power transformer condition is very important for utilities, to ensure continuous power transmission and power supply. Therefore, different techniques are used for condition assessment, as off-line diagnostics and on-line monitoring. The off-line diagnostics has some time period between consecutive diagnoses, and during that period the condition is unknown. Diagnostic tools in monitoring system usually comprise comparison of values of monitored quantities to preset limits, and alarming if these limits are exceeded. In this way weak diagnostic capabilities are achieved.
Therefore, a new diagnosis model for assessment of condition of oil immersed power transformers was developed. This model is aimed to continuously and automatically diagnose transformer condition. The diagnosis principle is interpretation of dissolved gas analysis (DGA) data using several standardized interpretation methods. Then, on the basis of obtained diagnoses an overall diagnosis is inferred using VAC, VEV or VSC inference methods in a similar way as it is done by the human diagnostician.
The diagnostic model shows excellent application flexibility, high robustness and significant diagnostic accuracy.

Semiconductor design rules and process windows continue to shrink, and developing new processes to accommodate parameters such as less-than-50nm design rules and a 300mm wafer becomes increasingly challenging. Next-generation defect inspection is urgently demanded. Optics and electron beams have been the main technologies for detection of the critical defects, but both have their disadvantages. Optical inspection is generally not sensitive enough for defects at 100nm geometries and below, while SEM inspection has low throughput because it takes a long time to scan 300 mm. In order to find a solution to these problems, we propose a novel optical inspection method for critical defects on semiconductor wafers. Until now, 1-dimensional resolution beyond the Rayleigh limit has been theoretically studied and experimentally bought to realization by a method called super resolution. To apply the proposed method to a sample with 2-dimensional structure, we have altered the proposed method making a standing wave shift in 2 directions, and carrying out super-resolution in each shifting direction. We carried out a fundamental verification of this method by computer simulation and experiment. As a result, we discovered the possibility of resolving a 2-dimensional structure which can't be resolved by the normal imaging system.

This paper deals with a new application of mechatronic means for precision mechanics, usually used in precision instrumentation and measurement equipment. Angle calibration means have been developed using mechatronic elements. Mechatronic arrangements for systematic error correction in mechatronic positioning systems and information – measuring systems are explained pointing out the main advantages of such systems applied for specific purposes.

In order to improve and optimize the procedure for calibration of radiation thermometers, an automated calibration bench was developed. Manual calibration with the help of special stands is time consuming and less reliable compared to automated calibration. The developed calibration bench has 5 degree of freedom (DOF) (3 translation joints and 2 rotation joints). For each axis we have used motorized movement control by means of a stepper motor. Stepper motors control circuit has built-in microcontroller, which controls the speed and direction of rotation of the stepper motors and communicates with the PC. The user interface is implemented as a virtual instrument in LabVIEW programming environment.