SIMULATION OF THE ”SINGLE VIA THERMAL CYCLE TEST” FINITE ELEMENT MODELLING OF PCBS UNDER THERMAL LOADS |
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| K. Fellner, P. F. Fuchs, G. Pinter |
- Abstract:
- The “Single Via Thermal Cycle Test” (SVTCT) is a thermal cycle test used for life time assessment of Printed Circuit Boards (PCBs) under cyclic thermal loads. During the SVTCT, the electrical conductivities of the interconnections (vias) of the tested PCB are monitored by resistance measurements. Hence, by a decrease of electrical conductivity, failure can be detected. A single via in a PCB is modeled using an axisymmetric simulation model. The simulations are conducted decoupled. One model for computing the temperature field in the PCB and another model to compute the stress and strain distribution are generated. The calculated stress and strain distributions are opposed to microsections of vias in PCBs, which have been subjected to the SVTCT. All cracks occurred at locations, which are highly stressed according to the simulations. This research work is part of the Master’s Thesis “Simulation of the ‘Single Via Thermal Cycle Test’ - modelling and determination of the material input parameters”.
- Keywords:
- printed circuit board, interlayer connection, copper, prepreg, thermal expansion, finite element simulation, decoupled simulation
- Download:
- IMEKO-YSESM-2014-006.pdf
- DOI:
- -
- Event details
- IMEKO TC:
- TC15
- Event name:
- TC15 Youth Symposium 2014
- Title:
13th Youth Symposium on Experimental Solid Mechanics
- Place:
- Děčín, CZECH REPUBLIC
- Time:
- 29 June 2014 - 02 July 2014